DocumentCode
2363290
Title
Investigations of parallel connected IGBT´s using electromagnetic field analysis
Author
Morishita, Kazuhiro ; Kitamura, S. ; Yamaguchi, Y. ; Yamaguchi, Yoshihiro ; Nakayama, Yasushi ; Usui, Osamu ; Ohi, Takeshi ; Thal, Eckhard
Author_Institution
Fukuryo Semicon Eng. Corp., Fukuoka
fYear
2005
fDate
11-14 Sept. 2005
Abstract
Chip current imbalances caused by the structure and layout of main circuit and gate circuit in an insulated gate bipolar transistor (IGBT) module were analyzed using three-dimensional electromagnetic analysis. To confirm the results of the analysis, we also measured the current of each chip using a test module. A good agreement between the analytical result and the measurement result was achieved. Furthermore, we were able to specify the key factors of current imbalance and the effectiveness of the design using three-dimensional electromagnetic analysis was proven
Keywords
electromagnetic fields; insulated gate bipolar transistors; chip current imbalances; current imbalance; gate circuit; insulated gate bipolar transistor; parallel connected IGBT; test module; three-dimensional electromagnetic analysis; Circuit testing; Coils; Conductors; Current measurement; Electromagnetic analysis; Electromagnetic fields; Electromagnetic measurements; Impedance; Insulated gate bipolar transistors; Semiconductor device packaging; Package impedance; Power semiconductor module; Rogowski coils; current imbalance; electromagnetic analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics and Applications, 2005 European Conference on
Conference_Location
Dresden
Print_ISBN
90-75815-09-3
Type
conf
DOI
10.1109/EPE.2005.219657
Filename
1665847
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