Title :
Properties of corrosion stains on thin gold plating
Author :
Lin, Xue-Yan ; Zhang, Ji-gao
Author_Institution :
Res. Lab. of Electr. Contacts, Beijing Univ. of Posts & Telecommun., China
Abstract :
Surface analysis of gold platings with different thicknesses after 3, 8, 15 and 22 months indoor air exposure was carried out. Some attractive phenomena are described in this paper. Corrosion products on gold plating are observed as the core products surrounded by different sizes of corrosion stains under an optical microscope. The stain appears as numerous tiny islands under SEM observation, which is spread and accumulated as rings or part of rings. The pore corrosion on thin gold plating is much more serious than that on the thick gold plating. It is found that contact resistance changes from point to point along a straight line through the stain area, and the values are much higher than normal in the whole stain area no matter where the testing probe is located inside the stain. It is reasonable to count the whole stain area at the contact region as failure surface area. Ratio of corrosion stain area to the sampling area versus exposure time matches Weibull probability distribution curve. Calculation leads to prediction of the reliability of contacts. Gold plating thickness below 0.5 μm may appear high risk in this environment. Dust particles are also deposited on gold plating during indoor air exposure. In some corrosion stain areas, elements of dust are found. Dust may enhance the corrosion and also cause high contact resistance.
Keywords :
Weibull distribution; contact resistance; corrosion; dust; electrical contacts; environmental degradation; failure analysis; gold; optical microscopy; scanning electron microscopy; surface chemistry; surface contamination; 0.5 micron; 15 month; 22 month; 3 month; 8 month; Au; SEM; Weibull probability distribution; concentric corrosion ring; contact region; contact reliability prediction; contact resistance; contact surface finish; corrosion products; corrosion stain area; corrosion stain sizes; corrosion stains; dust particles; exposure time; failure surface area; gold plating thickness; indoor air exposure; optical microscopy; point to point contact resistance; pore corrosion; reliability; sampling area; stain islands; surface analysis; testing probe; thick gold plating; thin gold plating; Cobalt alloys; Contact resistance; Corrosion; Gold; Nickel; Optical microscopy; Probes; Scanning electron microscopy; Surface morphology; Testing;
Conference_Titel :
Electrical Contacts, 2002. Proceedings of the Forty-Eighth IEEE Holm Conference on
Print_ISBN :
0-7803-7433-9
DOI :
10.1109/HOLM.2002.1040836