Morphological effects and their relation with the electrical resistivity measured during the initial stages of growth of Au/glass films

Author

Corona, J.E. ; Oliva, A.I.

Author_Institution

Dept. of Appl. Phys., CINVESTAV-IPN, Merida, Mexico

fYear

2005

fDate

7-9 Sept. 2005

Firstpage

204

Lastpage

206

Abstract

The electrical resistivity measured during the first stages of growth on gold thin films is compared with the surface morphology data obtained in order to relate the percolation effects observed on the AFM images. By using a free-software WSxM Ver 7.1 from Nanotec we analyzed the surface of gold films deposited on glass substrates by thermal evaporation by means of flooding surfaces. Film thickness was ranged from 4 to 40 nm. Results show a clear dependence between surface characteristics and the electrical resistivity, meaning that observed percolation effects on films have a large influence on the electrical resistivity. Poor physical connections between grains in the first 25 nm of thickness are the main cause of the observed effects.

Keywords

electrical resistivity; glass; gold; metallic thin films; percolation; surface morphology; 4 to 40 nm; AFM images; Au; Au-glass films; WSxM software; electrical resistivity; glass substrates; gold film deposition; grain connection; morphological effects; percolation effects; surface morphology data; thermal evaporation; thin film growth; Cities and towns; Corona; Electric resistance; Electric variables measurement; Glass; Gold; IEEE catalog; Physics; Surface morphology; Thickness measurement; electrical resistivity; gold films; morphology;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical and Electronics Engineering, 2005 2nd International Conference on

Print_ISBN

0-7803-9230-2

Type

conf

DOI

10.1109/ICEEE.2005.1529608

Filename

1529608