The design of new, Pb-free solder alloys with improved properties

Author

McCormack, M. ; Jin, S. ; Kammlott, G.W.

Author_Institution

AT&T Bell Labs., Murray Hill, NJ, USA

fYear

1995

fDate

1-3 May 1995

Firstpage

171

Lastpage

176

Abstract

The goal of the research presented in this paper is to identify Pb-free alloys with melting temperatures close to or lower than that of the near-eutectic 40Pb-60Sn solder (melting point of 183°C), and that with the best mechanical properties. We have obtained substantially improved mechanical properties through manipulation of alloy microstructures. The following three alloys with superior mechanical properties are discussed: i) Sn-3.5%Ag-1%Zn-0.5%Cu with a melting point of ~216°C, ii) Sn-8%Zn-5%In-(0.1-0.5%)Ag with a melting point of ~187°C, and iii) 54.5%Bi-45%Sn-0.5%Ag with a melting point of ~140°C

Keywords

bismuth alloys; copper alloys; ductility; indium alloys; mechanical strength; melting point; silver alloys; soldering; tin alloys; zinc alloys; 140 degC; 187 degC; 216 degC; BiSnAg; SnAgZnCu; SnZnInAg; alloy microstructures; ductility; mechanical properties; melting temperatures; solder alloys; Electronic components; Electronics packaging; Manufacturing processes; Material properties; Mechanical factors; Microstructure; Modems; Soldering; Technological innovation; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics and the Environment, 1995. ISEE., Proceedings of the 1995 IEEE International Symposium on

Conference_Location

Orlando, FL

Print_ISBN

0-7803-2137-5

Type

conf

DOI

10.1109/ISEE.1995.514970

Filename

514970