DocumentCode
2364917
Title
Influence of computer chassis design on metal fabrication waste streams
Author
Sheng, P. ; Willis, B., III ; Shiovitz, A.
Author_Institution
Dept. of Mech. Eng., California Univ., Berkeley, CA, USA
fYear
1995
fDate
1-3 May 1995
Firstpage
209
Lastpage
215
Abstract
There is growing interest in studying the influence of design decisions within a product life cycle, especially in designing for ease of disassembly and recycling. However, a significant life-cycle component of the wastes associated with the product occur at the primary manufacturing stages. This paper examines the environmental impact of chassis design features on process flow for metal fabrication. Critical processes include blanking, punch, metal deformation , finishing and welding. The availability of data at several levels of aggregation is supplemented by the development of analytical models of process physics to derive a process-level inventory of energy utilization, primary scrap and secondary catalysts (tool, fluid and vapor waste streams). The mass flows of waste streams can be weighted by impact on factors such as toxicity, carcinogenesis, reactivity, flammability, and irritation using material safety data and survey of site-specific factors. A case study of a chassis assembly for a network server is presented with several design alternatives to illustrate the impact of feature changes and component consolidation on waste streams. The trade-offs between environmental, manufacturing and product performance factors are discussed
Keywords
computers; design engineering; electronic equipment manufacture; environmental engineering; metalworking; waste disposal; computer chassis design; design decisions; disassembly; energy utilization; environmental impact; metal fabrication processes; metal fabrication waste streams; primary manufacturing stages; primary scrap; process flow; process-level inventory; product life cycle; recycling; Analytical models; Availability; Blanking; Fabrication; Finishing; Manufacturing; Physics; Process design; Recycling; Welding;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics and the Environment, 1995. ISEE., Proceedings of the 1995 IEEE International Symposium on
Conference_Location
Orlando, FL
Print_ISBN
0-7803-2137-5
Type
conf
DOI
10.1109/ISEE.1995.514977
Filename
514977
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