Title :
Electronic conduction in silicon phthalocyanine thin films
Author :
Diaz, T. ; Juarez, H. ; Rosendo, E. ; García, A. ; Sosa-Sánchez, J.L. ; Romero-Paredes, G. ; Garcia, G. ; Rubin, M. ; Serrano, L. ; Osorio, E.
Author_Institution :
Centro de Investigaciones en Dispositivos Semicond., Univ. Autonoma de Puebla, Mexico
Abstract :
Si-Phthalocyanines (SiPc) thin films were deposited on conductive substrates and their electronic properties were studied in sandwich-like Metal-SiPc-Metal structures. The current-voltage characteristics at different temperatures were determined. Aluminum and gold were used as electrode metals. For the Au-SiPc-Au structures, the J-V results were interpreted by using the space-charge-limited-conductivity theory and subsequently the trap density and hole mobility in the SiPc volume were determined. For the Al-SiPc-Al structure the J-V curves were analyzed based on the Schottky theory and the barrier height value for the Al-SiPc barrier was calculated. Moreover, the current density level flowing through the structure was depending on the polarization (forward o reverse) applied to the structure. This effect was attributed to the possible existence of an oxide at the interface between the top electrode and the SiPc.
Keywords :
aluminium compounds; electrical conductivity; gold compounds; metal-semiconductor-metal structures; organic semiconductors; thin films; Al-SiPc-Al structures; Schottky theory; barrier height; conductive substrates; current density level; current-voltage characteristics; electrode metals; electronic conduction; electronic properties; hole mobility; metal-SiPc-metal structure; silicon phthalocyanine thin film; space-charge-limited-conductivity theory; trap density; Aluminum; Conductive films; Current-voltage characteristics; Electrodes; Electron traps; Gold; Semiconductor thin films; Silicon; Sputtering; Temperature; Al-SiPc-Al structures; Electronic conduction; Silicon phthalocyanine Thin films;
Conference_Titel :
Electrical and Electronics Engineering, 2005 2nd International Conference on
Print_ISBN :
0-7803-9230-2
DOI :
10.1109/ICEEE.2005.1529666