• DocumentCode
    2365746
  • Title

    Design and Fabrication Issues of a Silicon-Based Vibration Powered Electric Energy Generator Using Parallel Plate and In-Plane Mechanism

  • Author

    Paracha, A.M. ; Basset, P. ; Lim, C.L.P. ; Marty, F. ; Poulichet, P. ; Amendola, G. ; Bourouina, T.

  • Author_Institution
    ESIEE-ESYCOM
  • fYear
    2006
  • fDate
    6-10 Nov. 2006
  • Firstpage
    2915
  • Lastpage
    2920
  • Abstract
    This paper focuses on the design and fabrication issues of a silicon-based, vibration powered, electric energy generator. Its architecture is based on the parallel plate configuration. It uses electrostatic damping of variable MEMS capacitor as the energy converting mechanism. Variable capacitance is achieved by in-plane movement of the top electrode. Hence capacitance variation is achieved by means of change in overlap area. The device is composed of a movable silicon proof mass with patterned electrodes on the underside, anodically bonded to a glass wafer with electrodes on top. High capacitance value can be achieved thanks to a low cost silicon-glass technology. FEM simulations along with the mechanical characterization have shown that 1.8 muW can be harvested for a 1 cm2 device at the mechanical resonance frequency of 300 Hz and starting voltage of 5 V
  • Keywords
    design engineering; electric generators; electrostatics; finite element analysis; micromechanical devices; plates (structures); power capacitors; 1.8 muW; 300 Hz; 5 V; FEM simulations; electrostatic damping; energy converting mechanism; inplane mechanism; mechanical resonance frequency; parallel plate configuration; silicon-based vibration powered electric energy generator; silicon-glass technology; variable MEMS capacitor; Capacitance; Capacitors; Damping; Electrodes; Electrostatics; Fabrication; Micromechanical devices; Power generation; Silicon; Vibrations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    IEEE Industrial Electronics, IECON 2006 - 32nd Annual Conference on
  • Conference_Location
    Paris
  • ISSN
    1553-572X
  • Print_ISBN
    1-4244-0390-1
  • Type

    conf

  • DOI
    10.1109/IECON.2006.347301
  • Filename
    4153093