Adhesive Bonding Process Development for Planar Lightwave Circuit in Optical Transceiver Assembly

Author

Liang, Cai ; Zhou, Xiaofeng ; Zhang, Fajian

Author_Institution

Samuel Ginn Coll. of Eng., Auburn Univ., AL

fYear

0

fDate

0-0 0

Firstpage

29

Lastpage

33

Abstract

Glass based planar lightwave circuit (PLC) is one of the core components employed in optical transceiver operation. Assembly of PLC onto a silicon optical bench (SiOB) is a crucial step, since it requires actively aligning the PLC to both a laser diode and an optical fiber. We have successfully developed an adhesive bonding process for buried type planar glass wave-guide circuit assembly in optical transceiver packaging with the powerful design optimal experiment tool. A dosage of 280j/cm² with intensity of 15000mw/cm² UV curing followed by 15 minutes 110degC thermal cure process is able to achieve 0.2dB optical coupling power loss for PLC-fiber assembly

Keywords

adhesive bonding; curing; glass; optical fibres; optical planar waveguides; optical receivers; optical transmitters; semiconductor lasers; 110 C; 15 mins; adhesive bonding; laser diode; optical fiber; optical transceiver; planar glass waveguide circuit; planar lightwave circuit; ultraviolet curing; Assembly; Bonding processes; Circuits; Diode lasers; Glass; Optical devices; Optical fibers; Programmable control; Silicon; Transceivers; DOE; PLC; SiOB; UV Cure; active alignment; adhesive bonding; optical transceiver; passive alignment;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials: Processes, Properties and Interface, 200611th International Symposium on

Conference_Location

Atlanta, GA

ISSN

1550-5723

Print_ISBN

1-4244-0260-3

Type

conf

DOI

10.1109/ISAPM.2006.1665982

Filename

1665982