• DocumentCode
    2365842
  • Title

    Materials and Processing Impacts on Flip Chip Assembly using Pre-applied Underfill

  • Author

    Esler, David

  • Author_Institution
    GE Global Res., Niskayuna, NY
  • fYear
    0
  • fDate
    0-0 0
  • Firstpage
    37
  • Lastpage
    37
  • Abstract
    Summary form only given. Pre-applied underfill materials for eutectic tin lead flip chip solder attach have been developed to produce void free, reliable assemblies. Lead free flip solder attach presents a number of challenges for quality assembly using pre-applied underfill. Factors that effect fluxing, yield, and voiding will be addressed
  • Keywords
    assembling; electronics packaging; flip-chip devices; soldering; solders; eutectic tin lead flip chip solder; flip chip assembly; lead free flip solder attach; materials processing; pre-applied underfill; Assembly; Environmentally friendly manufacturing techniques; Flip chip; Lead; Materials reliability; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging Materials: Processes, Properties and Interface, 200611th International Symposium on
  • Conference_Location
    Atlanta, GA
  • ISSN
    1550-5723
  • Print_ISBN
    1-4244-0260-3
  • Type

    conf

  • DOI
    10.1109/ISAPM.2006.1665986
  • Filename
    1665986
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2365842