DocumentCode
2365990
Title
A Practical Electrolyte for the Electrodeposition of Eutectic Gold/Tin Alloy
Author
Hradil, George
Author_Institution
Technic Inc., Cranston, RI
fYear
0
fDate
0-0 0
Firstpage
45
Lastpage
50
Abstract
Gold-tin alloys are useful in many microelectronic applications, including chip bonding and wafer bump plating. The 80-20 wt% (70-30 at%) gold-tin eutectic alloy is particularly desirable as a solder. Electro-deposition is a low cost alternative to currently employed techniques such as sputtering, plasma jet or the use of solid alloy preforms
Keywords
electroplating; eutectic alloys; gold alloys; solders; tin alloys; chip bonding; electrodeposition; electrolyte; eutectic alloy; gold alloy; microelectronic applications; plasma jet; solder; solid alloy performs; sputtering; tin alloy; wafer bump plating; Current density; Gold alloys; Microelectronics; Plasma applications; Preforms; Solids; Sputtering; Stability; Tin alloys; Wafer bonding; Gold; Tin; alloy; eutectic; plating;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials: Processes, Properties and Interface, 200611th International Symposium on
Conference_Location
Atlanta, GA
ISSN
1550-5723
Print_ISBN
1-4244-0260-3
Type
conf
DOI
10.1109/ISAPM.2006.1665994
Filename
1665994
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