Title :
A Practical Electrolyte for the Electrodeposition of Eutectic Gold/Tin Alloy
Author_Institution :
Technic Inc., Cranston, RI
Abstract :
Gold-tin alloys are useful in many microelectronic applications, including chip bonding and wafer bump plating. The 80-20 wt% (70-30 at%) gold-tin eutectic alloy is particularly desirable as a solder. Electro-deposition is a low cost alternative to currently employed techniques such as sputtering, plasma jet or the use of solid alloy preforms
Keywords :
electroplating; eutectic alloys; gold alloys; solders; tin alloys; chip bonding; electrodeposition; electrolyte; eutectic alloy; gold alloy; microelectronic applications; plasma jet; solder; solid alloy performs; sputtering; tin alloy; wafer bump plating; Current density; Gold alloys; Microelectronics; Plasma applications; Preforms; Solids; Sputtering; Stability; Tin alloys; Wafer bonding; Gold; Tin; alloy; eutectic; plating;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interface, 200611th International Symposium on
Conference_Location :
Atlanta, GA
Print_ISBN :
1-4244-0260-3
DOI :
10.1109/ISAPM.2006.1665994
