DocumentCode :
2366083
Title :
Materials Challenges and Solutions for the Packaging of High Power LEDs
Author :
Lin, G. ; Zhou, Yan ; Tran, Nugen ; Chiang, Weichun ; He, Yongzhi ; Shi, Frank G.
Author_Institution :
California Univ., Irvine, CA
fYear :
0
fDate :
0-0 0
Firstpage :
63
Lastpage :
63
Abstract :
Abstract form only given. As a future lighting source, high power LED lighting is significant in that it provides decades of lifetime under normal operation, requiring a fraction of the power required for traditional lighting solutions. For LED lighting to be a viable lighting source, there are many technical challenges to be resolved. Among them the light extraction efficiency, the chip over heating, the thermal and radiation degradation of the optical output power are the key issues, which turn out are all related to the packaging materials. This work will outline those challenges in details and report the recent progress in resolving those key problems
Keywords :
light emitting diodes; light sources; packaging; chip over heating; high power LED packaging; lighting source; packaging materials; radiation degradation; thermal degradation; Heating; Helium; LED lamps; Light emitting diodes; Optical materials; Packaging; Thermal degradation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interface, 200611th International Symposium on
Conference_Location :
Atlanta, GA
ISSN :
1550-5723
Print_ISBN :
1-4244-0260-3
Type :
conf
DOI :
10.1109/ISAPM.2006.1665998
Filename :
1665998
Link To Document :
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