Title :
Bottom emitting 1.3 μm BH-FP laser with integrated 45° reflector and monitor photodiode
Author :
Janiak, K. ; Albrecht, P. ; Fidorra, S. ; Heidrich, H. ; Rehbein, W. ; Roehle, H. ; Althaus, H.-L.
Author_Institution :
Heinrich-Hertz-Inst. fur Nachrichtentech. Berlin GmbH, Germany
Abstract :
We realized for the first time by a complete monolithic integration a bottom emitting laser OEIC including laser, monitor photodiode, and prism for SMT-packaging. This approach with the fabrication of the laser and reflection mirrors in full wafer technology exploits additionally the cost efficient advantages of on wafer facet preparation and on-wafer characterization.
Keywords :
integrated optoelectronics; laser cavity resonators; laser mirrors; laser transitions; monitoring; optical prisms; photodiodes; semiconductor lasers; surface mount technology; 1.3 micron; 45° reflector; SMT-packaging; bottom emitting 1.3 μm BH-FP laser; bottom emitting laser OEIC; full wafer technology; monitor photodiode; monolithic integration; on-wafer characterization; optical fabrication; prism; reflection mirrors; wafer facet preparation; Chemical lasers; Etching; Mirrors; Monitoring; Optical resonators; Packaging; Photodiodes; Power lasers; Surface emitting lasers; Vertical cavity surface emitting lasers;
Conference_Titel :
Semiconductor Laser Conference, 2002. IEEE 18th International
Print_ISBN :
0-7803-7598-X
DOI :
10.1109/ISLC.2002.1041143
