• DocumentCode
    2366211
  • Title

    Novel All Organic High Dielectric Constant Polyaniline/epoxy Composites for Embedded Capacitor Applications

  • Author

    Lu, Jiongxin ; Moon, Kyoung-Sik ; Byung-Kook Kin ; Wong, C.P.

  • Author_Institution
    Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA
  • fYear
    0
  • fDate
    0-0 0
  • Firstpage
    88
  • Lastpage
    92
  • Abstract
    In-situ polymerization of aniline salt within epoxy matrices with various content of polyaniline (PANI) was successfully carried out to prepare PANI/epoxy composites. A flexible PANI/epoxy composite prepared in this fashion reached a high dielectric constant close to 3000, a dielectric loss less than 0.5 at room temperature and 10 kHz. The influence of PANI loading levels on various properties was also explored. Scanning electron microscopy (SEM) was used to characterize the morphology of PANI/epoxy composites
  • Keywords
    capacitors; filled polymers; permittivity; polymerisation; scanning electron microscopy; aniline salt; dielectric constant; dielectric loss; embedded capacitor; epoxy composites; in-situ polymerization; polyaniline composites; scanning electron microscopy; Capacitors; Conductivity; Dielectric losses; High K dielectric materials; High-K gate dielectrics; Materials science and technology; Polarization; Polymers; Scanning electron microscopy; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging Materials: Processes, Properties and Interface, 200611th International Symposium on
  • Conference_Location
    Atlanta, GA
  • ISSN
    1550-5723
  • Print_ISBN
    1-4244-0260-3
  • Type

    conf

  • DOI
    10.1109/ISAPM.2006.1666006
  • Filename
    1666006