• DocumentCode
    2366232
  • Title

    The synergistic effect of carbon nanotubes and clay on the toughness of epoxy nanocomposites

  • Author

    Mei, Qilin ; Wang, Jihui ; Huang, Zhixiong ; Yuan, Lu

  • Author_Institution
    Sch. of Mater. Sci. & Eng., Wuhan Univ. of Technol., Wuhan
  • fYear
    2008
  • fDate
    24-27 March 2008
  • Firstpage
    280
  • Lastpage
    284
  • Abstract
    The diglycidyl ether of bisphenol A (DGEBA) epoxy resin containing different shape nanofillers, such as multi-wall carbon nanotubes (MWCNTs), clay and clay-MWCNTs composites, were prepared separately, and diaminodiphenyl sulfone (DDS) hardener was used as curing agent. The nanocomposites were processed by shear mixing and speed mixture at different clay concentrations (2 and 5 wt%) and varied MWCNTs concentrations (from 0.1 to 0.5 wt%). Investigation by X-ray diffraction (XRD) revealed that an exfoliated nanocomposite structure was formed in which the clay layers were randomly dispersed in the matrix. Morphologies of the fracture surfaces of nanocomposites were characterized by field emission scanning electron microscopy (SEM). The fracture toughness test results show that clay-MWCNT exhibits a synergistic effect on toughening epoxy resin.
  • Keywords
    X-ray diffraction; carbon nanotubes; clay; nanocomposites; polymers; C; X-ray diffraction; bisphenol A; carbon nanotubes; clay; diglycidyl ether; epoxy nanocomposites; epoxy resin; field emission scanning electron microscopy; nanofillers; Carbon nanotubes; Curing; Epoxy resins; Morphology; Nanocomposites; Scanning electron microscopy; Shape; Surface cracks; X-ray diffraction; X-ray scattering; carbon nanotubes; clay; fracture toughness; hybrid; nanocomposites; synergistic effect;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanoelectronics Conference, 2008. INEC 2008. 2nd IEEE International
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-1572-4
  • Electronic_ISBN
    978-1-4244-1573-1
  • Type

    conf

  • DOI
    10.1109/INEC.2008.4585486
  • Filename
    4585486