• DocumentCode
    2366325
  • Title

    Scaleable Board-Level High Performance Optical Polymer Waveguide Technologies

  • Author

    Liu, Fuhan ; Wang, Fengtao ; Yu, Jianjun ; Guidotti, Daniel ; Adibi, Ali ; Chang, Gee-Kung ; Tummala, Rao ; Moynihan, Matt ; Sicard, Bruno

  • Author_Institution
    Microsystems Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA
  • fYear
    0
  • fDate
    0-0 0
  • Firstpage
    109
  • Lastpage
    114
  • Abstract
    We present key technologies developed at Georgia Tech PRC for manufacture able and scaleable high performance waveguides on packages or on printed circuit boards (PCBs). The rough and irregular topographic surface is the first challenge when waveguides are implanted onto a high-density interconnects (HDI) board. Optical buffer layer technology is developed to modify the rough and irregular topography of PCB to a surface with less than 5 nanometer smoothness, which is required for making high quality waveguides, waveguide-based devices and micro optical components. Defects such as particle contaminations, mechanical scratches and damages, and debris etc. process related problem is a big challenge for manufacturability of volume production for the optoelectronics industry. As a solution, a novel cap-clad technology has been developed to make defect-free or defect-less waveguides and high definition optical devices. This technology allows us to make high quality waveguides at a low cost package or PCB environment. Fabrication of other optical components such as 45 degree micro-mirrors and micro-lenses is also discussed and demonstrated in this paper. In the end, the thermal mechanical and optical reliability issues are studied by experiments
  • Keywords
    optical polymers; optical waveguides; printed circuits; cap-clad technology; high-density interconnects; microlenses; micromirrors; microoptical components; optical buffer layer technology; optical polymer waveguide; optical reliability; printed circuit boards; thermal mechanical reliability; Components, packaging, and manufacturing technology; Optical devices; Optical polymers; Optical surface waves; Optical waveguides; Packaging; Rough surfaces; Surface roughness; Surface topography; Surface waves;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging Materials: Processes, Properties and Interface, 200611th International Symposium on
  • Conference_Location
    Atlanta, GA
  • ISSN
    1550-5723
  • Print_ISBN
    1-4244-0260-3
  • Type

    conf

  • DOI
    10.1109/ISAPM.2006.1666012
  • Filename
    1666012