DocumentCode
2366325
Title
Scaleable Board-Level High Performance Optical Polymer Waveguide Technologies
Author
Liu, Fuhan ; Wang, Fengtao ; Yu, Jianjun ; Guidotti, Daniel ; Adibi, Ali ; Chang, Gee-Kung ; Tummala, Rao ; Moynihan, Matt ; Sicard, Bruno
Author_Institution
Microsystems Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA
fYear
0
fDate
0-0 0
Firstpage
109
Lastpage
114
Abstract
We present key technologies developed at Georgia Tech PRC for manufacture able and scaleable high performance waveguides on packages or on printed circuit boards (PCBs). The rough and irregular topographic surface is the first challenge when waveguides are implanted onto a high-density interconnects (HDI) board. Optical buffer layer technology is developed to modify the rough and irregular topography of PCB to a surface with less than 5 nanometer smoothness, which is required for making high quality waveguides, waveguide-based devices and micro optical components. Defects such as particle contaminations, mechanical scratches and damages, and debris etc. process related problem is a big challenge for manufacturability of volume production for the optoelectronics industry. As a solution, a novel cap-clad technology has been developed to make defect-free or defect-less waveguides and high definition optical devices. This technology allows us to make high quality waveguides at a low cost package or PCB environment. Fabrication of other optical components such as 45 degree micro-mirrors and micro-lenses is also discussed and demonstrated in this paper. In the end, the thermal mechanical and optical reliability issues are studied by experiments
Keywords
optical polymers; optical waveguides; printed circuits; cap-clad technology; high-density interconnects; microlenses; micromirrors; microoptical components; optical buffer layer technology; optical polymer waveguide; optical reliability; printed circuit boards; thermal mechanical reliability; Components, packaging, and manufacturing technology; Optical devices; Optical polymers; Optical surface waves; Optical waveguides; Packaging; Rough surfaces; Surface roughness; Surface topography; Surface waves;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials: Processes, Properties and Interface, 200611th International Symposium on
Conference_Location
Atlanta, GA
ISSN
1550-5723
Print_ISBN
1-4244-0260-3
Type
conf
DOI
10.1109/ISAPM.2006.1666012
Filename
1666012
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