Constitutive Modeling of Sn/Ag and Sn/Ag/Cu Solder Alloys

Author

Pei, Min ; Qu, Jianmin

Author_Institution

Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA

fYear

0

fDate

0-0 0

Firstpage

118

Lastpage

118

Abstract

In this paper, we report some results from a recent study on developing constitutive laws suitable for Sn/Ag and Sn/Ag/Cu based solder materials. Extensive thermomechanical testing has been conducted on these lead-free solder alloys under various temperature (-55C-150C) and strain rate (10^-7/s-10^-1/s), subjected to both monotonic and cyclic loading. The experimental data are then used to develop a viscoplastic constitutive model to describe the thermomechanical behavior. In addition, a neural network based computational tool has been developed and trained. The tool can be used to extract the various parameters in the constitutive model based on the experimental data. The validity and accuracy of this tool have been verified by using the Anand model on Sn/Pb eutectic solder alloy. Once trained, the tool is capable of extracting all 11 parameters in the Anand model using the experimentally obtained stress-strain curves. These parameters can then be used directly in commercial finite element software such as ANSYS or ABAQUS for solder joint reliability analysis. Using this tool, we have obtained all 11 parameters in the Anand model for Sn/Ag and Sn/Ag/Cu based solder materials

Keywords

copper alloys; electronic engineering computing; eutectic alloys; neural nets; reliability; silver alloys; solders; thermomechanical treatment; tin alloys; -55 to 150 C; Anand model; Sn-Ag-Cu; eutectic solder alloy; finite element software; microelectronics packaging; neural network based computational tool; solder joints; stress-strain curves; thermomechanical reliability; thermomechanical testing; viscoplastic constitutive model; Capacitive sensors; Conducting materials; Copper alloys; Data mining; Environmentally friendly manufacturing techniques; Lead; Temperature; Testing; Thermomechanical processes; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials: Processes, Properties and Interface, 200611th International Symposium on

Conference_Location

Atlanta, GA

ISSN

1550-5723

Print_ISBN

1-4244-0260-3

Type

conf

DOI

10.1109/ISAPM.2006.1666016

Filename

1666016