Title :
Differences between the nc-Si:H thin films deposited by RF-sputtering and PECVD
Author :
Zhanxia, Shao ; Min, Li ; Yan, Zhan ; Huacong, Yu ; Ma Zhongquan ; Tietun, Sun
Author_Institution :
Dept. of Phys., Shanghai Univ., Shanghai
Abstract :
Nanocrystalline silicon thin films were deposited by radio frequency(RF) sputtering and by PECVD separately with the processing parameters varied. A combination of X-ray diffraction (XRD), ellipsometry and Raman measurements were used to characterize the films. The optical band gaps(Eg opt) were derived from Tauc plots, and the result showed that the films prepared by RF-sputtering has a wider band-gap compared with the film deposited by PECVD, and suitable for the solar cell window layer. A investigation of the differences in Raman shift and the crystallization ratio(Xc) between the two kinds of films were also carried out. The XRD results shown that the film deposited by the radio frequency(RF) sputtering has a preferred orientation in (201) and this preferred diffraction orientation corresponds to tetragon microstructure, which has a wider band-gap compared with the silicon films deposited by PECVD.
Keywords :
Raman spectra; X-ray diffraction; crystallisation; elemental semiconductors; ellipsometry; energy gap; hydrogen; nanostructured materials; nanotechnology; optical constants; plasma CVD; semiconductor thin films; silicon; sputter deposition; texture; PECVD; RF-sputtering; Raman spectra; Si:H; Tauc plots; X-ray diffraction; XRD; crystallization ratio; ellipsometry; nanocrystalline silicon thin films; optical band gaps; preferred diffraction orientation; radio frequency sputtering; solar cell window layer; tetragon microstructure; Optical diffraction; Optical films; Photonic band gap; Radio frequency; Semiconductor films; Semiconductor thin films; Silicon; Sputtering; X-ray diffraction; X-ray scattering;
Conference_Titel :
Nanoelectronics Conference, 2008. INEC 2008. 2nd IEEE International
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1572-4
Electronic_ISBN :
978-1-4244-1573-1
DOI :
10.1109/INEC.2008.4585498