DocumentCode
2366450
Title
Differences between the nc-Si:H thin films deposited by RF-sputtering and PECVD
Author
Zhanxia, Shao ; Min, Li ; Yan, Zhan ; Huacong, Yu ; Ma Zhongquan ; Tietun, Sun
Author_Institution
Dept. of Phys., Shanghai Univ., Shanghai
fYear
2008
fDate
24-27 March 2008
Firstpage
330
Lastpage
334
Abstract
Nanocrystalline silicon thin films were deposited by radio frequency(RF) sputtering and by PECVD separately with the processing parameters varied. A combination of X-ray diffraction (XRD), ellipsometry and Raman measurements were used to characterize the films. The optical band gaps(Eg opt) were derived from Tauc plots, and the result showed that the films prepared by RF-sputtering has a wider band-gap compared with the film deposited by PECVD, and suitable for the solar cell window layer. A investigation of the differences in Raman shift and the crystallization ratio(Xc) between the two kinds of films were also carried out. The XRD results shown that the film deposited by the radio frequency(RF) sputtering has a preferred orientation in (201) and this preferred diffraction orientation corresponds to tetragon microstructure, which has a wider band-gap compared with the silicon films deposited by PECVD.
Keywords
Raman spectra; X-ray diffraction; crystallisation; elemental semiconductors; ellipsometry; energy gap; hydrogen; nanostructured materials; nanotechnology; optical constants; plasma CVD; semiconductor thin films; silicon; sputter deposition; texture; PECVD; RF-sputtering; Raman spectra; Si:H; Tauc plots; X-ray diffraction; XRD; crystallization ratio; ellipsometry; nanocrystalline silicon thin films; optical band gaps; preferred diffraction orientation; radio frequency sputtering; solar cell window layer; tetragon microstructure; Optical diffraction; Optical films; Photonic band gap; Radio frequency; Semiconductor films; Semiconductor thin films; Silicon; Sputtering; X-ray diffraction; X-ray scattering;
fLanguage
English
Publisher
ieee
Conference_Titel
Nanoelectronics Conference, 2008. INEC 2008. 2nd IEEE International
Conference_Location
Shanghai
Print_ISBN
978-1-4244-1572-4
Electronic_ISBN
978-1-4244-1573-1
Type
conf
DOI
10.1109/INEC.2008.4585498
Filename
4585498
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