Title :
Temperature Aware Scheduling for Embedded Processors
Author :
Jayaseelan, Ramkumar ; Mitra, Tulika
Author_Institution :
Dept. of Comput. Sci., Nat. Univ. of Singapore, Singapore
Abstract :
Power density has been increasing at an alarming rate in recent processor generations resulting in high on-chip temperature. Higher temperature results in poor reliability and increased leakage current. In this paper, we propose a temperature aware scheduling technique in the context of embedded multi-tasking systems. We observe that there is a high variability in the thermal properties of different embedded applications. We design temperature-aware scheduling (TAS) scheme that exploits this variability to maintain the system temperature below a desired level while satisfying a number of requirements such as throughput, fairness and real time constraints. Moreover, TAS enables exploration of the tradeoffs between throughput and fairness in temperature-constrained systems. Compared against standard schedulers with reactive hardware-level thermal management, TAS provides better throughput with negligible impact on fairness.
Keywords :
embedded systems; multiprogramming; processor scheduling; embedded multitasking systems; embedded processors; power density; temperature aware scheduling; thermal properties; Context awareness; Leakage current; Maintenance; Power generation; Power system reliability; Processor scheduling; Real time systems; Temperature; Thermal management; Throughput; Scheduling; Temperature; Thermal Management;
Conference_Titel :
VLSI Design, 2009 22nd International Conference on
Conference_Location :
New Delhi
Print_ISBN :
978-0-7695-3506-7
DOI :
10.1109/VLSI.Design.2009.42