Title :
Die level CDM testing duplicates assembly operation failures
Author :
Bernier, By Joe ; Croft, Gregg
Author_Institution :
Harris Semicond., Melbourne, FL, USA
Abstract :
Field induced charged device model (FCDM) testing on individual dice has shown that die sort operations can cause electrostatic discharge (ESD) failures. CDM pulses as low as 100 volts to the back side of a die duplicated production failures. Static generated by the separation of dice from the wafer saw mounting film was found to be the underlying cause.
Keywords :
assembling; electrostatic discharge; failure analysis; integrated circuit testing; 100 V; CDM testing; assembly operation failure; dice separation; die sort; electrostatic discharge; field induced charged device model; wafer saw mounting film; Assembly; Electrostatic discharges; Failure analysis; Integrated circuit testing;
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium, 1996. Proceedings
Print_ISBN :
1-878303-69-4
DOI :
10.1109/EOSESD.1996.865133
