DocumentCode
2366704
Title
Cooling Challenges in Military Helicopter Applications
Author
Yao, Matthew ; Wilcoxon, Ross
Author_Institution
Adv. Technol. Center, Rockwell Collins, Cedar Rapids, IA
fYear
0
fDate
0-0 0
Firstpage
160
Lastpage
160
Abstract
Due to the unique operational environment, higher packaging density, and increasing power consumption, there is a growing cooling need for electronic equipment on board military helicopters. However, conduction remains to be the main cooling mechanism for electronic components in these applications. This paper attempts to address current thermal solutions and challenges along with system, mechanical, and reliability constraints. Future thermal management trends and needs are also discussed
Keywords
cooling; heat conduction; helicopters; military avionics; reliability; thermal management (packaging); electronic equipment cooling; heat conduction; military helicopters; packaging density; thermal management; Electronic components; Electronic equipment; Electronic packaging thermal management; Electronics cooling; Energy consumption; Helicopters; Military aircraft; Military equipment; Packaging machines; Power system reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials: Processes, Properties and Interface, 200611th International Symposium on
Conference_Location
Atlanta, GA
ISSN
1550-5723
Print_ISBN
1-4244-0260-3
Type
conf
DOI
10.1109/ISAPM.2006.1666035
Filename
1666035
Link To Document