DocumentCode
2366843
Title
Fabrication of silver nanowires in situ in Si chip based on a novel electrochemical method
Author
Liu, Jia ; Fu, Yunyi ; Guo, Ao ; Wang, Chuan ; Huang, Ru ; Zhang, Xiang
Author_Institution
Inst. of Microelectron., Peking Univ., Beijing
fYear
2008
fDate
24-27 March 2008
Firstpage
424
Lastpage
427
Abstract
In this paper, we report a novel electrochemical deposition (ECD) method to fabricate silver nanoscale wires and dendrites. We carry out the electrochemical deposition (ECD) process on a small piece of Si wafer. On its surface, there are micro-scale predefined silver electrodes. We use organic solution (N,N-dimethylformamide (DMF)) instead of metal salt solution as the electrolyte. Usually the fractal structures can be formed in the electrochemical deposition (ECD) process. When an external resistor is introduced in the ECD circuit, instead of fractal structures, silver nanoscale wires and dendrites can be obtained between two electrodes in situ in the Si chip. The diameters of the silver nanowires are about 40-200 nm and the electric properties of the silver nanowire with a diameter about 100 nm have been measured. We have proposed a possible formation mechanism for these silver nanoscale wires and dendrites.
Keywords
dendrites; electrochemistry; electrodeposition; fractals; nanowires; silicon; silver; Ag; N,N-dimethylformamide; Si; dendrites fabrication; electrochemical deposition method; electrolyte; external resistor; formation mechanism; fractal structures; micro-scale predefined silver electrodes; organic solution; silicon wafer; silver nanowires fabrication; Circuits; Electric variables measurement; Electrodes; Fabrication; Fractals; Nanostructures; Nanowires; Resistors; Silver; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Nanoelectronics Conference, 2008. INEC 2008. 2nd IEEE International
Conference_Location
Shanghai
Print_ISBN
978-1-4244-1572-4
Electronic_ISBN
978-1-4244-1573-1
Type
conf
DOI
10.1109/INEC.2008.4585520
Filename
4585520
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