DocumentCode :
2366852
Title :
Antistatic masking tapes for solder flux reflow processing of printed circuit boards
Author :
Ball, Alan ; Yau, Steve ; Gutman, Gustav ; Swenson, David E.
Author_Institution :
Electr. Specialities Div., 3M Co., Austin, TX, USA
fYear :
1996
fDate :
10-12 Sept. 1996
Firstpage :
241
Lastpage :
247
Abstract :
This work shows that it is possible to develop acrylate adhesive masking tapes for the most demanding current forms of electronic device soldering. Performance testing confirms that these tapes are suitably stable at high temperature. They also retain their unique capability for subduing electrostatic charge generation. In this property these tapes exceeded the performance of all similar tapes, to which they were compared, including silicone-based tapes.
Keywords :
electrostatics; printed circuit manufacture; reflow soldering; acrylate adhesive; antistatic masking tape; electronic device; electrostatic charge generation; printed circuit board; solder flux reflow processing; Electrostatic analysis; Printed circuit fabrication; Soldering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium, 1996. Proceedings
Print_ISBN :
1-878303-69-4
Type :
conf
DOI :
10.1109/EOSESD.1996.865148
Filename :
865148
Link To Document :
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