• DocumentCode
    2367470
  • Title

    Simulation of boron diffusion in Si based on the kick-out mechanism

  • Author

    Uematsu, Masashi

  • Author_Institution
    NTT LSI Labs., Kanagawa, Japan
  • fYear
    1996
  • fDate
    2-4 Sept. 1996
  • Firstpage
    25
  • Lastpage
    26
  • Abstract
    B in-diffusion profiles in Si were simulated based on the kick-out mechanism, taking into account neutral boron interstitials and positively charged and neutral self-interstitials as the diffusion species which primarily contribute to the diffusion. The profiles were satisfactorily fitted by just three parameters, each of which has a clear physical meaning. This study clarifies the essential parameters for B diffusion, which helps to develop a more widely applicable diffusion simulator.
  • Keywords
    boron; diffusion; elemental semiconductors; interstitials; semiconductor doping; semiconductor process modelling; silicon; Si:B; boron diffusion; interstitial; kick-out mechanism; silicon; simulation; Bismuth; Boron; Diffusion processes; Doping profiles; Fabrication; Laboratories; Large scale integration; Partial differential equations; Shape; Silicon devices;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices, 1996. SISPAD 96. 1996 International Conference on
  • Print_ISBN
    0-7803-2745-4
  • Type

    conf

  • DOI
    10.1109/SISPAD.1996.865256
  • Filename
    865256