DocumentCode
2367470
Title
Simulation of boron diffusion in Si based on the kick-out mechanism
Author
Uematsu, Masashi
Author_Institution
NTT LSI Labs., Kanagawa, Japan
fYear
1996
fDate
2-4 Sept. 1996
Firstpage
25
Lastpage
26
Abstract
B in-diffusion profiles in Si were simulated based on the kick-out mechanism, taking into account neutral boron interstitials and positively charged and neutral self-interstitials as the diffusion species which primarily contribute to the diffusion. The profiles were satisfactorily fitted by just three parameters, each of which has a clear physical meaning. This study clarifies the essential parameters for B diffusion, which helps to develop a more widely applicable diffusion simulator.
Keywords
boron; diffusion; elemental semiconductors; interstitials; semiconductor doping; semiconductor process modelling; silicon; Si:B; boron diffusion; interstitial; kick-out mechanism; silicon; simulation; Bismuth; Boron; Diffusion processes; Doping profiles; Fabrication; Laboratories; Large scale integration; Partial differential equations; Shape; Silicon devices;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices, 1996. SISPAD 96. 1996 International Conference on
Print_ISBN
0-7803-2745-4
Type
conf
DOI
10.1109/SISPAD.1996.865256
Filename
865256
Link To Document