• DocumentCode
    2367763
  • Title

    Application of LE-FDTD method to HF circuit analysis

  • Author

    Ciampolini, P. ; Roselli, L. ; Catena, S.

  • Author_Institution
    Istituto di Elettronica, Perugia Univ., Italy
  • fYear
    1996
  • fDate
    2-4 Sept. 1996
  • Firstpage
    53
  • Lastpage
    54
  • Abstract
    A circuit simulation technique is discussed, which accounts for the "full-wave" analysis of signal propagation along the interconnections of an arbitrary circuit, including active, non-linear devices. A number of electromagnetic propagation effects have significant influence over high-frequency (either analog or digital) circuit performances and can be accurately modeled by means of the approach described: among them, interconnection behavior, cross-talk phenomena, package interactions. Conventional circuit CAD tools allow the analysis of such effects by resorting to equivalent-circuit, lumped-element descriptions of interconnecting lines. Although this technique is highly computationally efficient, the definition of the equivalent circuit topology and the estimation of its parameters often relies on rather drastic approximations, because of the inherently "distributed" nature of most propagation effects. To tackle this problem, the Lumped-Element, Finite-Difference Time-Domain (LE-FDTD) technique has been conceived. Within this approach, SPICE-like compact device models are coupled to the numerical solutions of Maxwell\´s equation over distributed domains. The extension of LE-FDTD technique to circuits including GaAs MESFET devices is reported, and a few simulation examples are illustrated.
  • Keywords
    SPICE; active networks; circuit CAD; circuit analysis computing; crosstalk; finite difference time-domain analysis; lumped parameter networks; HF circuit analysis; LE-FDTD method; SPICE-like compact device models; active nonlinear devices; circuit CAD; circuit simulation technique; cross-talk phenomena; distributed domains; electromagnetic propagation effects; full-wave analysis; interconnection behavior; lumped-element finite-difference time-domain method; package interactions; signal propagation; Circuit analysis; Circuit simulation; Distributed computing; Electromagnetic modeling; Electromagnetic propagation; Equivalent circuits; Hafnium; Integrated circuit interconnections; Packaging; Signal analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices, 1996. SISPAD 96. 1996 International Conference on
  • Print_ISBN
    0-7803-2745-4
  • Type

    conf

  • DOI
    10.1109/SISPAD.1996.865270
  • Filename
    865270