Title :
Thermal simulation of PCBs with embedded resistors
Author :
Witwit, A.M.R. ; Stubbs, D. ; Pulko, S.H. ; Wilkinson, A.J.
Author_Institution :
Dept. of Electron. Eng., Hull Univ., UK
fDate :
30 Sep-2 Oct 1998
Abstract :
The application of the transmission line matrix (TLM) method to PCB structures incorporating heat generating integrated resistors is described. We investigate the sensitivity of resistor temperature with respect to resistor area, and the number and size of via holes. The temperature of resistors embedded in different layers of a 6-layer PCB structure is investigated. It is found that resistors on the surface layer suffer a greater temperature increase than those which are embedded. It is shown that the presence of copper on a layer drastically reduced the temperature on that layer
Keywords :
printed circuit design; 6-layer PCB structure; PCB simulation; TLM method; copper; embedded resistors; heat generating integrated resistors; resistor area; resistor temperature; surface layer; thermal simulation; transmission line matrix method; via holes;
Conference_Titel :
Simulation '98. International Conference on (Conf. Publ. No. 457)
Conference_Location :
York
Print_ISBN :
0-85296-709-8
DOI :
10.1049/cp:19980656
