• DocumentCode
    2367861
  • Title

    Zoom Microscope Based Micropositioning for MEMS Sensor Packaging System

  • Author

    Liguo, Chen ; Lingyu, Ma ; Lining, Sun ; Weibin, Rong

  • Author_Institution
    Robotics Inst., Harbin Inst. of Technol.
  • fYear
    2006
  • fDate
    6-10 Nov. 2006
  • Firstpage
    3863
  • Lastpage
    3867
  • Abstract
    This paper presents a zoom microscope based micropositioning system using feedback of multiple magnification images caught through a CMOS cameras mounted on an optical microscope. The requirement for real-time autofocusing for zoom microscope is proposed based on the analysis of zoom microscope model. In order to guarantee the accurate micropositioning of MEMS sensor packaging system, high magnification optical microscope is used. However, the small field-of-view of optical microscope essentially limits the workspace of the micromanipulator and the low depth-of-field makes it difficult to handle micro parts. To overcome these obstacles and increase the precision of micropositioning system, a zoom microscope is chosen to gain multiple magnification images. With low magnification, objects can be identified and located roughly. The precise position of objects can be calculated accurately with high magnification image. At last the autofocusing experiment and micro parts centering experiments are executed based on the micropositioning strategy. This micropositioning method, which base on zoom microscope, can also be used in micromanipulation and microassembly system
  • Keywords
    CMOS image sensors; feedback; micromanipulators; micropositioning; microsensors; optical microscopes; CMOS cameras; MEMS sensor; feedback; micro parts centering; microassembly system; micromanipulator; micropositioning; multiple magnification images; optical microscope; packaging system; real-time autofocusing; zoom microscope; CMOS image sensors; Cameras; Micromanipulators; Micromechanical devices; Optical feedback; Optical microscopy; Optical sensors; Packaging; Semiconductor device modeling; Sensor systems;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    IEEE Industrial Electronics, IECON 2006 - 32nd Annual Conference on
  • Conference_Location
    Paris
  • ISSN
    1553-572X
  • Print_ISBN
    1-4244-0390-1
  • Type

    conf

  • DOI
    10.1109/IECON.2006.347250
  • Filename
    4153192