DocumentCode
236802
Title
Efficient stochastic transient analysis of high-speed passive distributed networks using Loewner Matrix based macromodels
Author
Talukder, Md A. H. ; Kabir, Muhammad ; Roy, Sandip ; Khazaka, Rami
Author_Institution
Dept. of Electr. & Comput. Eng., McGill Univ., Montréal, QC, Canada
fYear
2014
fDate
4-8 Aug. 2014
Firstpage
209
Lastpage
212
Abstract
Distributed networks with embedded parametric uncertainty can be characterized in the frequency-domain by tabulated augmented multiport S or Y-parameter responses based on a stochastic Galerkins formulation of the network equations. In this work, the Loewner Matrix approach is utilized to generate a compact SPICE-compatible macromodel of the stochastic distributed network from the tabulated frequency-domain data for transient analysis. The key attribute of this work is that the superior scaling of the computational complexity of the Loewner Matrix approach with respect to the augmented number of network ports allows for a more efficient generation of the macromodel than the classical Vector Fitting approach. This leads to faster transient analysis for problems involving large random spaces. The advantage of the proposed approach is validated using a numerical example.
Keywords
Galerkin method; computational complexity; distributed parameter networks; stochastic processes; Loewner Matrix approach; Loewner matrix based macromodels; S-parameter responses; Y-parameter responses; compact SPICE-compatible macromodel; computational complexity; embedded parametric uncertainty; high-speed passive distributed networks; stochastic Galerkins formulation; stochastic distributed network; stochastic transient analysis; tabulated augmented multiport; tabulated frequency-domain data; transient analysis; vector fitting approach; Equations; Mathematical model; Method of moments; Ports (Computers); Stochastic processes; Transmission line matrix methods; Vectors; Curve fitting; Loewner Matrices; macromodeling; stochastic analysis; time-domain analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility (EMC), 2014 IEEE International Symposium on
Conference_Location
Raleigh, NC
Print_ISBN
978-1-4799-5544-2
Type
conf
DOI
10.1109/ISEMC.2014.6898971
Filename
6898971
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