DocumentCode :
2368143
Title :
High Performance AlGaN/GaN HEMT Switches Employing 500 ° C Oxidized Ni/Au Gate for Very Low Leakage Current and Improvement of Uniformity
Author :
Seung-Chul Lee ; Jiyong Lim ; Min-Woo Ha ; Jin-Cherl Her ; Chong-Man Yun ; Min-Koo Han
Author_Institution :
Sch. of Electr. Eng., Seoul Nat. Univ.
fYear :
2006
fDate :
4-8 June 2006
Firstpage :
1
Lastpage :
4
Abstract :
The electrical characteristics of HEMT such as leakage current and breakdown voltage were improved considerably by oxidation of Ni/Au Schottky gate of HEMT. Leakage current was decreased from 4.2muA to 3.3nA and uniform high breakdown voltage of ~480V was obtained with floating gate. On-resistance was also decreased from 4.32mOmega-cm2 to 3.89mOmega-cm2 when oxidation time was 5min due to the improvement of the 2DEG which was increased from 7.82times1012/cm2 to 9.61times1012/cm2. Our experimental results show that oxidation of Ni/Au Schottky gate which is rather simple may be suitable for improvement of AlGaN/GaN HEMT
Keywords :
III-V semiconductors; aluminium compounds; gallium compounds; gold; leakage currents; nickel; oxidation; power HEMT; power MESFET; power semiconductor switches; semiconductor device breakdown; two-dimensional electron gas; 5 min; 500 C; AlGaN-GaN; HEMT switches; Ni-Au; Schottky gate; electrical characteristics; floating gate; high breakdown voltage; leakage current; Aluminum gallium nitride; Annealing; Degradation; Electric variables; Gallium nitride; Gold; HEMTs; Leakage current; Oxidation; Switches;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices and IC's, 2006. ISPSD 2006. IEEE International Symposium on
Conference_Location :
Naples
Print_ISBN :
0-7803-9714-2
Type :
conf
DOI :
10.1109/ISPSD.2006.1666100
Filename :
1666100
Link To Document :
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