DocumentCode
2368283
Title
Yield, overall test environment timing accuracy, and defect level trade-offs for high-speed interconnect device testing
Author
Wang, Baosheng ; Cho, Yong B. ; Tabatabaei, Sassan ; Ivanov, André
Author_Institution
Dept. of Electr. & Comput. Eng., British Columbia Univ., Canada
fYear
2003
fDate
16-19 Nov. 2003
Firstpage
348
Lastpage
353
Abstract
This paper extends the model in (Wajih Dalai et al, Proc. of Int. Test Conf., p.518-523, 1999) to be more realistic by including the effects of the test fixtures between a device under test and a tester. The paper enables analyzing the trade-offs that arise between the predicted yield and the required overall test environment timing accuracy (OTETA) which involves the tester overall timing accuracy (OTA) and the test fixture impact. We specifically focus on the application of the extended model to predict the test yield of standard high-speed interconnects, such as PCI Express, RapidIO, and HyperTransport. The extended model reveals that achieving an actual yield of 80% with a defect level of 300 DPM (defects per million) requires an equivalent OTETA that is about half the acceptable absolute limit of the tested parameter.
Keywords
electronic equipment testing; interconnections; test equipment; timing; HyperTransport; OTETA; PCI Express; RapidIO; defect level trade-offs; high-speed interconnect device testing; overall test environment timing accuracy; test fixture effects; tester OTA; testing yield; timing specifications testing; yield analysis; yield defect level; Accuracy; Delay estimation; Electronic equipment testing; Fixtures; Manufacturing processes; Microprocessors; Predictive models; Statistical analysis; Test equipment; Timing; Yield estimation;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Symposium, 2003. ATS 2003. 12th Asian
ISSN
1081-7735
Print_ISBN
0-7695-1951-2
Type
conf
DOI
10.1109/ATS.2003.1250835
Filename
1250835
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