Title :
Numerical Simulations for Electromagnetic Power Module Design
Author :
Cottet, Didier ; Hartmann, Samuel ; Schlapbach, Ulrich
Author_Institution :
ABB Switzerland Ltd. Corporate Res., Baden-Dattwil
Abstract :
Solutions are presented to specifically address electromagnetic design issues in power modules, using numerical simulation methods. Four different aspects are described, each of which simulated using the appropriate numerical methods and tools: the characteristics of package components, the dynamic switching behavior, the module internal EMI, and the high voltage isolation
Keywords :
electromagnetic interference; power semiconductor devices; semiconductor device models; semiconductor device packaging; dynamic switching behavior; electromagnetic design; electromagnetic power module design; high voltage isolation; module internal EMI; numerical simulation methods; package components; Circuit simulation; Design optimization; Electromagnetic analysis; Electromagnetic coupling; Insulated gate bipolar transistors; Multichip modules; Numerical simulation; Packaging; Substrates; Voltage;
Conference_Titel :
Power Semiconductor Devices and IC's, 2006. ISPSD 2006. IEEE International Symposium on
Conference_Location :
Naples
Print_ISBN :
0-7803-9714-2
DOI :
10.1109/ISPSD.2006.1666108
