DocumentCode :
2368513
Title :
Interaction analysis and insulation techniques for short-circuit integrated protection structure
Author :
Caramel, C. ; Austin, P. ; Sanchez, J.L. ; Imbernon, E. ; Rousset, B.
Author_Institution :
LAAS-CNRS, Toulouse
fYear :
2006
fDate :
4-8 June 2006
Firstpage :
1
Lastpage :
4
Abstract :
One of the steps of the power components reliability improvement is to integrate protection structures (Robb, 1994 and Yeki, 1994). An integrated structure which protect IGBT against short-circuit conditions has already been studied. This structure has been studied and improved for its integration in a classical IGBT technological process (Caramel, 2006). Generally, the integration of protection structures and power devices on the same substrate leads to insulation problems. In order to overcome these problems for our application, we propose in these paper three insulation techniques compatible with a classical IGBT technological process. [2D] numerical simulations have been thus performed in order to highlight the necessity of insulation and for compare the insulation techniques efficiency
Keywords :
insulated gate bipolar transistors; insulation; power bipolar transistors; semiconductor device models; semiconductor device reliability; short-circuit currents; 2D numerical simulations; IGBT technological process; insulated gate bipolar transistor; insulation techniques; integrated protection structure; power components reliability; short-circuit conditions; Anodes; Cathodes; Delay; Diodes; Insulated gate bipolar transistors; Insulation; Low voltage; Protection; Threshold voltage; Voltage control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices and IC's, 2006. ISPSD 2006. IEEE International Symposium on
Conference_Location :
Naples
Print_ISBN :
0-7803-9714-2
Type :
conf
DOI :
10.1109/ISPSD.2006.1666117
Filename :
1666117
Link To Document :
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