DocumentCode
2368548
Title
A Particular View Of Some Reliability Merits, Strengths And Limitations Of Plastic-Encapsulated Microcircuits (PEMs) Vs. Hermetically Sealed Microcircuits (HSMs) Utilised In High-Reliability Systems
Author
Bajenescu, Titu I.
Volume
3
fYear
1998
fDate
14-15 May 1998
Firstpage
783
Lastpage
784
Keywords
Corrosion; Cost function; Integrated circuit modeling; Integrated circuit testing; Magneto electrical resistivity imaging technique; Moisture; Passivation; Plastic packaging; Resins; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Optimization of Electrical and Electronic Equipments, 1998. OPTIM '98. Proceedings of the 6th International Conference on
Print_ISBN
973-98511-2-6
Type
conf
DOI
10.1109/OPTIM.1998.708046
Filename
708046
Link To Document