DocumentCode :
2368548
Title :
A Particular View Of Some Reliability Merits, Strengths And Limitations Of Plastic-Encapsulated Microcircuits (PEMs) Vs. Hermetically Sealed Microcircuits (HSMs) Utilised In High-Reliability Systems
Author :
Bajenescu, Titu I.
Volume :
3
fYear :
1998
fDate :
14-15 May 1998
Firstpage :
783
Lastpage :
784
Keywords :
Corrosion; Cost function; Integrated circuit modeling; Integrated circuit testing; Magneto electrical resistivity imaging technique; Moisture; Passivation; Plastic packaging; Resins; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Optimization of Electrical and Electronic Equipments, 1998. OPTIM '98. Proceedings of the 6th International Conference on
Print_ISBN :
973-98511-2-6
Type :
conf
DOI :
10.1109/OPTIM.1998.708046
Filename :
708046
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2368548
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