Title :
10 kV, 5A 4H-SiC Power DMOSFET
Author :
Ryu, Sei-Hyung ; Krishnaswami, Sumi ; Hull, Brett ; Richmond, James ; Agarwal, Anant ; Hefner, Allen
Author_Institution :
Cree, Inc., Durham, NC
Abstract :
In this paper, we report 4H-SiC power DMOSFETs capable of blocking 10 kV. The devices were scaled up to 5 A, which is a factor of 25 increase in device area compared to the previously reported value. The devices utilized 100 mum thick n-type epilayers with a doping concentration of 6 times 1014 cm-3 for drift layers, and a floating guard ring based edge termination structure was used. The gate oxide layer was formed by thermal oxidation at 1175 degC, followed by an NO anneal. A peak effective channel mobility of 13 cm2/Vs was extracted from a test MOSFET with a W/L of 150 mum / 150 mum, built adjacent to the power DMOSFETs. A 4H-SiC DMOSFET with an active area of 0.15 cm showed a specific on-resistance of 111 mOmega-cm2 at room temperature with a gate bias of 15 V. The device shows a leakage current of 3.3 muA, which corresponds to a leakage current density of 11 muA-cm-2 at a drain bias of 10 kV
Keywords :
oxidation; power MOSFET; rapid thermal annealing; semiconductor doping; silicon compounds; wide band gap semiconductors; 10 kV; 100 micron; 1175 C; 15 V; 3.3 muA; 5 A; NO anneal; SiC; channel mobility; doping concentration; drift layers; floating guard ring; power DMOSFET; thermal oxidation; thick n-type epilayers; Aluminum; Dielectric substrates; Doping; Electrodes; Implants; Nitrogen; Silicon; Temperature; Voltage; Working environment noise;
Conference_Titel :
Power Semiconductor Devices and IC's, 2006. ISPSD 2006. IEEE International Symposium on
Conference_Location :
Naples
Print_ISBN :
0-7803-9714-2
DOI :
10.1109/ISPSD.2006.1666122