DocumentCode
2368854
Title
Impact of channel engineering on unity gain frequency and noise-figure in 90nm NMOS transistor for RF applications
Author
Srinivasan, R. ; Bhat, Navakanta
Author_Institution
Dept. of Electr. & Comput. Eng., Indian Inst. of Sci., Bangalore, India
fYear
2005
fDate
3-7 Jan. 2005
Firstpage
392
Lastpage
396
Abstract
In this paper, we have studied and compared the RF performance metrics, unity gain frequency (ft) and noise figure (NF), of the devices with channel engineering consisting of halo and super steep retrograde channel (SSRC) implants, and the devices with uniform channel doping concentration, using process, device, and mixed mode simulations. The simulation results show that at 90nm gate lengths, for a given off-state leakage constraint (IOFF), devices with uniform channel doping concentration deliver higher ft and lower NF than the devices which used halo and SSRC, due to better sub-threshold slope and transconductance. However, at 0.25 μm technology the same is not true. Therefore, in the 90 nm devices uniform channel doping profile is recommended to get better RF performance.
Keywords
MOSFET; doping profiles; radiofrequency integrated circuits; semiconductor device models; semiconductor doping; 90 nm; NMOS transistor; RF performance metrics; channel engineering; gate lengths; mixed mode simulations; noise figure; off-state leakage constraint; subthreshold slope; super steep retrograde channel; transconductance; uniform channel doping concentration; unity gain frequency; Doping profiles; Implants; MOSFET circuits; Noise figure; Noise measurement; Performance gain; Radio frequency; Space technology; Transconductance; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Design, 2005. 18th International Conference on
ISSN
1063-9667
Print_ISBN
0-7695-2264-5
Type
conf
DOI
10.1109/ICVD.2005.107
Filename
1383307
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