• DocumentCode
    2368854
  • Title

    Impact of channel engineering on unity gain frequency and noise-figure in 90nm NMOS transistor for RF applications

  • Author

    Srinivasan, R. ; Bhat, Navakanta

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Indian Inst. of Sci., Bangalore, India
  • fYear
    2005
  • fDate
    3-7 Jan. 2005
  • Firstpage
    392
  • Lastpage
    396
  • Abstract
    In this paper, we have studied and compared the RF performance metrics, unity gain frequency (ft) and noise figure (NF), of the devices with channel engineering consisting of halo and super steep retrograde channel (SSRC) implants, and the devices with uniform channel doping concentration, using process, device, and mixed mode simulations. The simulation results show that at 90nm gate lengths, for a given off-state leakage constraint (IOFF), devices with uniform channel doping concentration deliver higher ft and lower NF than the devices which used halo and SSRC, due to better sub-threshold slope and transconductance. However, at 0.25 μm technology the same is not true. Therefore, in the 90 nm devices uniform channel doping profile is recommended to get better RF performance.
  • Keywords
    MOSFET; doping profiles; radiofrequency integrated circuits; semiconductor device models; semiconductor doping; 90 nm; NMOS transistor; RF performance metrics; channel engineering; gate lengths; mixed mode simulations; noise figure; off-state leakage constraint; subthreshold slope; super steep retrograde channel; transconductance; uniform channel doping concentration; unity gain frequency; Doping profiles; Implants; MOSFET circuits; Noise figure; Noise measurement; Performance gain; Radio frequency; Space technology; Transconductance; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Design, 2005. 18th International Conference on
  • ISSN
    1063-9667
  • Print_ISBN
    0-7695-2264-5
  • Type

    conf

  • DOI
    10.1109/ICVD.2005.107
  • Filename
    1383307