Thin-film packaging of high-power LEDs by magnetron sputtering

LED is called the fourth generation of lighting or green lighting. The total thermal resistance of high-power LEDs is mainly composed of the thermal resistance of the materials the interfaces. Inefficient heat release will directly influence on the performance and life of LEDs. Thus, the issue of heat release has become the biggest obstacle to the industrialization of high-power LEDs. To solve these problems, we proposed a new thin-film packaging for high-power LEDs. We produced samples by magnetron sputtering and measured its thermal resistance with the method of dynamic electrical method. Through the simulation and experiments we found that packaging thin-film packaging has the following advantages compared with the current PCB packaging: the heat-release performance is much better than PCB packaging, and it is more applicable with simple process and lower price.