DocumentCode :
236919
Title :
Investigating a guard trace ring to suppress the crosstalk due to a clock trace on a power electronics DSP control board
Author :
Jun Xu ; Shuo Wang
Author_Institution :
Power Electron. & Electr. Power Res. Lab., Univ. of Texas at San Antonio, San Antonio, TX, USA
fYear :
2014
fDate :
4-8 Aug. 2014
Firstpage :
525
Lastpage :
532
Abstract :
The grounded guard trace ring is usually utilized to suppress the crosstalk noise interference in high-speed printed circuit boards or IC packages. Although the guard ring can reduce crosstalk, its performance is greatly affected by the effectiveness of its design. This paper first investigates the mechanism of the crosstalk noise cancellation with a grounded guard ring. The paper then discusses and analyzes several grounding patterns. Based on this investigation, guidelines to improve the performance of a guard ring are proposed. It is found that the best grounding patterns for guard trace ring is to ground at the two ends instead of using multi-point grounding. The theoretical analysis and the developed technique are verified by electromagnetic (EM) field distribution plots and the 4-ports scattering parameters that are simulated in ANSYS HFSS 3D electromagnetic simulation software. Experiments were finally conducted to validate the analysis and the proposed technique.
Keywords :
crosstalk; digital signal processing chips; electromagnetic fields; integrated circuit packaging; interference suppression; power electronics; printed circuits; 4-ports scattering parameters; ANSYS HFSS 3D electromagnetic simulation software; EM plots; IC packages; PCB; clock trace; crosstalk noise cancellation; crosstalk noise interference; electromagnetic field distribution plots; grounding patterns; guard trace ring; high-speed printed circuit boards; multipoint grounding; power electronics DSP control board; Clocks; Couplings; Crosstalk; Digital signal processing; Grounding; Inductance; Magnetic fields; EMI; clock trace; crosstalk; grounding; guard trace ring; inductive coupling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility (EMC), 2014 IEEE International Symposium on
Conference_Location :
Raleigh, NC
Print_ISBN :
978-1-4799-5544-2
Type :
conf
DOI :
10.1109/ISEMC.2014.6899028
Filename :
6899028
Link To Document :
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