Title :
Nanostructured biosensors built by layer-by-layer assembly of multiwall carbon nanotubes and Zn-salen
Author :
Feng, Lin-Jie ; Wang, Li-wei ; Tian, Yuan ; Xian, Yue-Zhong ; Jin, Litong
Author_Institution :
Dept. of Chem., East China Normal Univ., Shanghai
Abstract :
Carbon nanotubes have a high electrochemically accessible area of porous tubes, good electronic conductance and strong mechanical property. These properties essentially suggest that CNTs are attractive materials for the construction of nanoscaled biosensors. Ligand frameworks such as the Schiff base containing salen ligand, that can be sterically and electronically modified with ease, are very attractive. The use of the salen ligand framework in catalytic reactions has been receiving increasing interest because of its success in many newly discovered processes. In this paper, MWCNTs and Zn-salen were alternative deposited onto the surface of glassy carbon electrode via layer-by-layer assembly technology. We find that (MWCNTs/Zn-salen)n multilayer films have excellent electrocatalytic activity for L-tyrosine and NO2 -. Hence, a nanostructured electrochemical sensor for simultaneous detection L-tyrosine and NO2 - was developed successfully.
Keywords :
biochemistry; biosensors; carbon nanotubes; catalysis; electrochemical electrodes; electrochemical sensors; molecular biophysics; multilayers; nanobiotechnology; nanotube devices; organic compounds; self-assembly; thin film sensors; C; L-tyrosine; NO2 - detection; Schiff base containing salen ligand; electrocatalytic reaction; electrochemically accessible area; electronic conductance; glassy carbon electrode; layer-by-layer assembly; layer-by-layer assembly technology; multilayer films; multiwall carbon nanotubes; nanostructured biosensors; nanostructured electrochemical sensor; porous tubes; Assembly; Biological materials; Biosensors; Building materials; Carbon nanotubes; Conducting materials; Electrodes; Electron tubes; Mechanical factors; Nanostructured materials;
Conference_Titel :
Nanoelectronics Conference, 2008. INEC 2008. 2nd IEEE International
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1572-4
Electronic_ISBN :
978-1-4244-1573-1
DOI :
10.1109/INEC.2008.4585650