Title :
De-embedding method to accurately measure high-frequency impedance of an O-shape spring contact
Author :
Qiaolei Huang ; Jing Li ; Joe Zhou ; Wu, Wenchuan ; Yihong Qi ; Jun Fan
Author_Institution :
EMC Lab., Missouri Univ. of Sci. & Technol., Rolla, MO, USA
Abstract :
In this paper, a de-embedding method is proposed to measure the impedance of an innovative O-shape spring contact, for frequency up to 30 GHz. To allow the de-embedding method to be applied in practical situations, both conductor loss and the discontinuity associated with the junction are taken into account. Results obtained from the de-embedding method are validated using full wave simulation. In the simulation model, the O-shape spring contact is cut into two pieces based on the current flow paths, providing a straightforward way to understand why a resonance exists in the impedance profile of the connector. Lastly, the advantages and drawbacks of this method are discussed.
Keywords :
electric impedance measurement; printed circuit interconnections; O-shape spring contact; conductor loss; deembedding method; frequency 30 GHz; full wave simulation; high-frequency impedance measurement; impedance profile; Fixtures; Frequency measurement; Impedance; Impedance measurement; Scattering parameters; Springs; Transmission line measurements; High frequency; Impedance; O-Clip;
Conference_Titel :
Electromagnetic Compatibility (EMC), 2014 IEEE International Symposium on
Conference_Location :
Raleigh, NC
Print_ISBN :
978-1-4799-5544-2
DOI :
10.1109/ISEMC.2014.6899041