DocumentCode
2369657
Title
Gate leakage and its reduction in deep submicron SRAM
Author
Goel, Ankur ; Mazhari, Baquer
Author_Institution
Dept. of Electr. Eng., IIT, Kanpur, India
fYear
2005
fDate
3-7 Jan. 2005
Firstpage
606
Lastpage
611
Abstract
In this work the impact of gate leakage on SRAM is described and two approaches for reducing gate leakage currents are examined in detail. In one approach, the supply voltage is reduced while in the other the potential of the ground node is raised. In both the approaches the effective voltage across SRAM cell is reduced in inactive mode using a dynamic self-controllable switch. Simulation results based on BPTM (Berkeley Predictive Technology Model) for 45nm channel length device show that the scheme in which supply voltage level is reduced is more efficient in reducing gate leakage than the one in which ground node potential is raised. Results obtained show that 96% reduction in the leakage currents of SRAM can be achieved.
Keywords
CMOS memory circuits; SRAM chips; leakage currents; low-power electronics; semiconductor switches; 45 nm; Berkeley Predictive Technology Model; deep submicron SRAM; dynamic self-controllable switch; gate leakage; ground node potential; supply voltage; Diodes; Gate leakage; Leakage current; Noise reduction; Power dissipation; Random access memory; Subthreshold current; Switches; Tunneling; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Design, 2005. 18th International Conference on
ISSN
1063-9667
Print_ISBN
0-7695-2264-5
Type
conf
DOI
10.1109/ICVD.2005.103
Filename
1383341
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