• DocumentCode
    2369657
  • Title

    Gate leakage and its reduction in deep submicron SRAM

  • Author

    Goel, Ankur ; Mazhari, Baquer

  • Author_Institution
    Dept. of Electr. Eng., IIT, Kanpur, India
  • fYear
    2005
  • fDate
    3-7 Jan. 2005
  • Firstpage
    606
  • Lastpage
    611
  • Abstract
    In this work the impact of gate leakage on SRAM is described and two approaches for reducing gate leakage currents are examined in detail. In one approach, the supply voltage is reduced while in the other the potential of the ground node is raised. In both the approaches the effective voltage across SRAM cell is reduced in inactive mode using a dynamic self-controllable switch. Simulation results based on BPTM (Berkeley Predictive Technology Model) for 45nm channel length device show that the scheme in which supply voltage level is reduced is more efficient in reducing gate leakage than the one in which ground node potential is raised. Results obtained show that 96% reduction in the leakage currents of SRAM can be achieved.
  • Keywords
    CMOS memory circuits; SRAM chips; leakage currents; low-power electronics; semiconductor switches; 45 nm; Berkeley Predictive Technology Model; deep submicron SRAM; dynamic self-controllable switch; gate leakage; ground node potential; supply voltage; Diodes; Gate leakage; Leakage current; Noise reduction; Power dissipation; Random access memory; Subthreshold current; Switches; Tunneling; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Design, 2005. 18th International Conference on
  • ISSN
    1063-9667
  • Print_ISBN
    0-7695-2264-5
  • Type

    conf

  • DOI
    10.1109/ICVD.2005.103
  • Filename
    1383341