Title :
Thruchip interface (TCI) for 3D integration of low-power system
Author :
Kuroda, Tadahiro
Author_Institution :
Keio Univ., Yokohama, Japan
Abstract :
This paper presents a counterpart of TSV and a circuit solution that enables 3D integration of power-aware systems. It bears comparison with TSV in performance but less expensive.
Keywords :
low-power electronics; three-dimensional integrated circuits; TCI; TSV; circuit solution; low-power system 3D integration; thruchip interface;
Conference_Titel :
Electron Devices Meeting (IEDM), 2010 IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4424-7418-5
Electronic_ISBN :
0163-1918
DOI :
10.1109/IEDM.2010.5703378
