DocumentCode :
2369787
Title :
Performances of coupled interconnect lines: the impact of inductance and routing orientation
Author :
Deschacht, D. ; Lopez, A.
Author_Institution :
Lab. d´´Informatique, de Robotique etde Microelectronique de Montpellier, UMR CNRS, Montpellier, France
fYear :
2005
fDate :
3-7 Jan. 2005
Firstpage :
640
Lastpage :
643
Abstract :
In this paper we show the influence of inductance and routing orientation on timing performances by considering two configurations of parallel coupled interconnects, one with both drivers on the same side, and the other with the drivers in opposite directions. For a typical DSM (deep-sub-micron) process, we show that when analyzing VLSI circuits, if standard distributed RC models are used, and inductive effects and routing orientation are ignored, large errors can occur in the prediction and evaluation of the circuit behavior. Both greatly affect circuit performances: the discrepancy rates can reach 20% and 18% respectively for the latency and 50% and 30% for the output switching delay. The routing orientation can lead to a difference of 18% for the latency and 35% for the output transition time when the two lines have the same transitions.
Keywords :
RC circuits; VLSI; driver circuits; inductance; integrated circuit interconnections; integrated circuit modelling; network routing; timing; VLSI circuits; circuit behavior; circuit performances; coupled interconnect lines; deep-sub-micron process; distributed RC models; inductive effects; routing orientation; switching delay; timing performances; Circuit analysis; Coupling circuits; Delay; Driver circuits; Inductance; Integrated circuit interconnections; Predictive models; Routing; Timing; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Design, 2005. 18th International Conference on
ISSN :
1063-9667
Print_ISBN :
0-7695-2264-5
Type :
conf
DOI :
10.1109/ICVD.2005.135
Filename :
1383346
Link To Document :
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