DocumentCode
2370115
Title
Evidence and solution of over-RESET problem for HfOX based resistive memory with sub-ns switching speed and high endurance
Author
Lee, H.Y. ; Chen, Y.S. ; Chen, P.S. ; Gu, P.Y. ; Hsu, Y.Y. ; Wang, S.M. ; Liu, W.H. ; Tsai, C.H. ; Sheu, S.S. ; Chiang, P.-C. ; Lin, W.P. ; Lin, C.H. ; Chen, W.S. ; Chen, F.T. ; Lien, C.H. ; Tsai, M-J
Author_Institution
Inst. of Electron. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
fYear
2010
fDate
6-8 Dec. 2010
Abstract
The memory performances of the HfOX based bipolar resistive memory, including switching speed and memory reliability, are greatly improved in this work. Record high switching speed down to 300 ps is achieved. The cycling test shed a clear light on the wearing behavior of resistance states, and the correlation between over-RESET phenomenon and the worn low resistance state in the devices is discussed. The modified bottom electrode is proposed for the memory device to maintain the memory window and to endure resistive switching up to 1010 cycles.
Keywords
high-speed integrated circuits; integrated circuit reliability; integrated memory circuits; bipolar resistive memory; memory device; memory reliability; over-RESET problem; switching speed; time 300 ps;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting (IEDM), 2010 IEEE International
Conference_Location
San Francisco, CA
ISSN
0163-1918
Print_ISBN
978-1-4424-7418-5
Electronic_ISBN
0163-1918
Type
conf
DOI
10.1109/IEDM.2010.5703395
Filename
5703395
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