DocumentCode
2370374
Title
180nm gate length amorphous InGaZnO thin film transistor for high density image sensor applications
Author
Jeon, Sanghun ; Park, Sungho ; Song, Ihun ; Hur, Ji-Hyun ; Park, Jaechul ; Kim, Sunil ; Kim, Sangwook ; Yin, Huaxiang ; Lee, Eunha ; Ahn, Seungeon ; Kim, Hojung ; Kim, Changjung ; Chung, U-in
Author_Institution
Semicond. Device Lab., Yongin, South Korea
fYear
2010
fDate
6-8 Dec. 2010
Abstract
In this article, we propose a novel hybrid complementary metal oxide semiconductor (CMOS) image sensor architecture utilizing nanometer scale amorphous In-Ga-Zn-O (a-IGZO) thin film transistors (TFT) combined with a conventional Si photo diode. This approach will overcome the loss of quantum efficiency and image quality due to the downscaling of the photodiode. The 180nm gate length a-IGZO TFT exhibits remarkable short channel device performance including a low 1/f noise and a high output gain, despite fabrication temperatures as low as 200°C. The excellent device performance has been achieved by a double layer gate dielectric (Al2O3/SiO2) and a trapezoidal active region formed by a tailored etching process. A self aligned top gate structure was employed for low parasitic capacitance. 3D process simulation tools were applied to optimize a four pixel CMOS image sensor structure. The results demonstrate how our stacked hybrid device approach contributes to new device strategies in image sensor architectures. We expect that this approach is applicable to numerous devices and systems in future micro- and nano-electronics.
Keywords
1/f noise; CMOS image sensors; etching; gallium compounds; indium compounds; photodiodes; thin film transistors; zinc compounds; 1/f noise; 3D process simulation tool; CMOS image sensor structure; InGaZnO; hybrid complementary metal oxide semiconductor; image quality; image sensor architecture; micro-electronics; nano-electronics; nanometer scale amorphous thin film transistor; photodiode; quantum efficiency; self aligned top gate structure; silicon photo diode; stacked hybrid device approach; tailored etching process;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting (IEDM), 2010 IEEE International
Conference_Location
San Francisco, CA
ISSN
0163-1918
Print_ISBN
978-1-4424-7418-5
Electronic_ISBN
0163-1918
Type
conf
DOI
10.1109/IEDM.2010.5703406
Filename
5703406
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