DocumentCode
2370649
Title
0.13μm 210GHz fT SiGe HBTs - expanding the horizons of SiGe BiCMOS
Author
Joseph, A. ; Coolbaugh, D. ; Harame, D. ; Freeman, C. ; Subbarma, S. ; Doherty, M. ; Bunn, J. ; Dickey, C. ; Greenberg, D. ; Groves, R. ; Meghelli, M. ; Rylyakov, A. ; Sorna, M. ; Schreiber, O. ; Herman, D. ; Tanji, T.
Author_Institution
IBM, Essex Jct., VT
Volume
2
fYear
2002
fDate
7-7 Feb. 2002
Firstpage
138
Lastpage
438
Abstract
This article consists of a collection of slides from the author´s conference presentation. SiGe BiCMOS is in its fourth lithographic generation since introduction of the 0.5μm. The key component is the SiGebase HBT whose performance (fT, fMAX) is improved to >200GHz in the 0.13μm generation. Evolution and future directions of SiGe BiCMOS technology and product applications are reviewed. See also digest page 180.
Keywords
Annealing; BiCMOS integrated circuits; CMOS technology; Cutoff frequency; Etching; Germanium silicon alloys; Heterojunction bipolar transistors; Isolation technology; Resistors; Silicon germanium;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference, 2002. Digest of Technical Papers. ISSCC. 2002 IEEE International
Conference_Location
San Francisco, CA, USA
Print_ISBN
0-7803-7335-9
Type
conf
DOI
10.1109/ISSCC.2002.992182
Filename
992182
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