Title : 
A new approach to on-chip probing in the MM-wave to THz range
         
        
            Author : 
Larsen, M.J.H. ; Brown, E.R.
         
        
            Author_Institution : 
Depts. of Electr. Eng. & Phys., Wright State Univ., Fairborn, OH, USA
         
        
        
        
        
        
            Abstract : 
One of the bigger obstacles in the development of THz devices and integrated circuits is their electrical characterization in the upper-millimeter to terahertz range above 100 GHz. Today´s technology is mainly based on metal-to-metal, dc-coupled contact probes. This technology is, however, expensive and fragile, and is difficult to scale to higher frequencies. This paper concerns contact-free probes that are (ac) coupled to the device or circuit-under-test by the polarization current rather than the conduction current. Numerical simulations are carried out to 1.0 THz and the probe coupling is found to be around -26 dB, with a bandwidth of at least 500 GHz.
         
        
            Keywords : 
numerical analysis; submillimetre wave integrated circuits; terahertz wave devices; THz devices; contact-free probes; dc-coupled contact probes; electrical characterization; frequency 1 THz; integrated circuits; metal-to-metal probes; numerical simulations; on-chip probing;
         
        
        
        
            Conference_Titel : 
Aerospace and Electronics Conference (NAECON), 2012 IEEE National
         
        
            Conference_Location : 
Dayton, OH
         
        
        
            Print_ISBN : 
978-1-4673-2791-6
         
        
        
            DOI : 
10.1109/NAECON.2012.6531021