DocumentCode :
2370687
Title :
High-Q FBAR filters in a wafer-level chip-scale package
Author :
Ruby, R.C. ; Barfknecht, A. ; Han, C. ; Desai, Y. ; Geefay, F. ; Gan, G. ; Gat, M. ; Verhoeven, T.
Author_Institution :
Agilent, Newark, CA
Volume :
2
fYear :
2002
fDate :
7-7 Feb. 2002
Firstpage :
142
Lastpage :
440
Keywords :
Bonding processes; Ceramics; Chip scale packaging; Costs; Film bulk acoustic resonators; Gaskets; Gold; SAW filters; Wafer bonding; Wafer scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference, 2002. Digest of Technical Papers. ISSCC. 2002 IEEE International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-7335-9
Type :
conf
DOI :
10.1109/ISSCC.2002.992184
Filename :
992184
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2370687
