DocumentCode

2370687

Title

High-Q FBAR filters in a wafer-level chip-scale package

Author

Ruby, R.C. ; Barfknecht, A. ; Han, C. ; Desai, Y. ; Geefay, F. ; Gan, G. ; Gat, M. ; Verhoeven, T.

Author_Institution

Agilent, Newark, CA

Volume

2

fYear

2002

fDate

7-7 Feb. 2002

Firstpage

142

Lastpage

440

Keywords

Bonding processes; Ceramics; Chip scale packaging; Costs; Film bulk acoustic resonators; Gaskets; Gold; SAW filters; Wafer bonding; Wafer scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Circuits Conference, 2002. Digest of Technical Papers. ISSCC. 2002 IEEE International

Conference_Location

San Francisco, CA, USA

Print_ISBN

0-7803-7335-9

Type

conf

DOI

10.1109/ISSCC.2002.992184

Filename

992184