DocumentCode
2370964
Title
System in a package design of a RF front end system using application specific reduced order models
Author
Nayak, Ghanshyam ; Washburn, Clyde ; Mukund, P.R.
Author_Institution
Dept. of Electr. Eng., Rochester Inst. of Technol., NY, USA
fYear
2005
fDate
3-7 Jan. 2005
Firstpage
878
Lastpage
881
Abstract
´Package aware´ IC Design has not only become advantageous, but also essential towards optimum performance of high-end systems. This is specifically true in RF front-end systems where the circuit performance is highly sensitive to package parasitics. Here, an intuitive design methodology has been presented that can help in the package aware design of the RF front end system using reduced order models. The reduced order models, whose order is based on the application of the package pins, are generated using krylov´s sub space technique. This technique allows for a fine balance between the need for accuracy and time efficiency, during design and layout of the RF front-end.
Keywords
circuit simulation; integrated circuit design; radiofrequency integrated circuits; system-on-chip; RF front end system; accuracy; application specific reduced order models; circuit performance; high-end systems; krylov sub space technique; package aware IC design; package parasitics; package pins application; system in a package design; time efficiency; Circuit optimization; Design methodology; Integrated circuit modeling; Packaging; Pins; Power system modeling; Radio frequency; Radiofrequency integrated circuits; Reduced order systems; Resonance;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Design, 2005. 18th International Conference on
ISSN
1063-9667
Print_ISBN
0-7695-2264-5
Type
conf
DOI
10.1109/ICVD.2005.159
Filename
1383392
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