DocumentCode :
2371007
Title :
Capacitive pressure microsensor fabricated by bulk micromachining and sacrificial layer etching
Author :
Luque, A. ; Bolea, R.G. ; Fernandez-Bolanos, M. ; Ionescu, A. ; Quero, J.M.
Author_Institution :
Dept. of Electron. Eng., Seville Univ.
fYear :
2006
fDate :
6-10 Nov. 2006
Firstpage :
2969
Lastpage :
2974
Abstract :
A new capacitive silicon pressure sensor fabricated by a combination of bulk and surface micromachining is presented. The sensor is composed of a polysilicon membrane that deflects due to the pressure difference applied over it. Its main advantages are a simple fabrication process and an efficient integrability with other devices. The behaviour of the sensor, obtained by mathematical modeling of the membrane deflection is presented, along with the numerical simulations that provide the characteristic curves. From these results, a study on how geometry affects sensor performance is deduced. Results obtained are in good agreement with previous similar devices
Keywords :
capacitive sensors; etching; mathematical analysis; membranes; micromachining; microsensors; polymers; pressure sensors; silicon; bulk micromachining; capacitive pressure microsensor; capacitive silicon pressure sensor; fabrication process; membrane deflection; polysilicon membrane; sacrificial layer etching; surface micromachining; Biomembranes; Capacitive sensors; Etching; Fabrication; Mathematical model; Micromachining; Microsensors; Numerical simulation; Sensor phenomena and characterization; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IEEE Industrial Electronics, IECON 2006 - 32nd Annual Conference on
Conference_Location :
Paris
ISSN :
1553-572X
Print_ISBN :
1-4244-0390-1
Type :
conf
DOI :
10.1109/IECON.2006.348052
Filename :
4153351
Link To Document :
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