To verify manufacturing yield by testing

The effect of test errors should be cancelled while before test yield is used to analyze the manufacturing yield. Test errors can be alleviated from engineering run and production run stages. One of the more difficult aspect of yield modeling is the fact that defect density is generally not constant with time. In this paper, we study the flow of defect monitor used in production test. Based on the yield data obtained from engineering stage, the upper and lower bounds of chip yield are calculated after determining the variance of defect density and clustering parameter. The yield bound/distribution is used to diagnose the results after wafer sort while in production. One ASIC product is used to validate this yield analysis procedure. This work can assist the ASIC design center to determine a manufacturing laboratory beginning the design and to control the chip area in the period of circuit design