Title :
Mechanical reliability of polyimide insulated interconnections in epoxy encapsulated package under temperature cycle test
Author :
Homma, Yoshio ; Sakuma, Noriyuki ; Nishida, Takashi ; Yoshida, Ikuo
Author_Institution :
Central Res. Lab., Hitachi Ltd., Tokyo, Japan
Abstract :
Deformation mechanism of polyimide insulated Al alloy lines in epoxy encapsulated package was clarified using temperature cycle test. A shrinkage stress due to the resin on top of the chip creates cracks in the epoxy-resin around the chip corners, and the resin delaminates from the chip to shrink. This causes the polyimide film to tear-off, and the 1st level alloy lines to deform, while upper levels enveloped by the polyimide film move without deformation. Following the model, reliability was improved by preventing the cracks being created in the resin, and/or increasing resin adhesion on chip surface
Keywords :
VLSI; encapsulation; environmental testing; failure analysis; metallisation; packaging; polymers; reliability; thermal expansion; Al alloy lines; VLSI; epoxy encapsulated package; multilevel interconnection; polyimide insulated interconnections; reliability improvement; reliability issues; shrinkage stress; temperature cycle test; Adhesives; Aluminum alloys; Insulation; Packaging; Polyimides; Resins; Stress; Surface cracks; Temperature; Testing;
Conference_Titel :
VLSI Multilevel Interconnection Conference, 1991, Proceedings., Eighth International IEEE
Conference_Location :
Santa Clara, CA
Print_ISBN :
0-87942-673-X
DOI :
10.1109/VMIC.1991.152995
